New RAIN RFID endpoint IC series will enable connectivity to everyday
items in the retail, grocery, consumer packaged goods, and logistics
markets
SEATTLE--(BUSINESS WIRE)--
Impinj,
Inc. (NASDAQ: PI), a leading provider and pioneer of RAIN
RFID solutions, today introduced new endpoint IC technologies to
meet the increasing demand for item connectivity in the retail, grocery,
consumer packaged goods, and logistics markets. Developed in an advanced
semiconductor process node, these technologies paint the future of RAIN
RFID by endowing Impinj endpoint ICs with differentiated features and
enhanced performance, enabling these and other emerging markets in the
coming months and years.
Innovations Improve Readability, Add New Features, and Enable Further
Developments
Impinj’s pioneering IC technologies improve readability and add new
features and functionality to:
-
increase the distance, reliability, and speed at which a RAIN RFID
system can inventory, locate, and engage items
-
enable key RAIN RFID use cases like item authentication, loss
prevention, frictionless point-of-sale, and shipment verification
-
allow Impinj’s inlay partners to design smaller, high-performing,
truly global RAIN RFID tags
“Our endpoint IC technology innovations leverage both Moore’s Law and
other leading-edge semiconductor advancements, improving IC performance
and increasing functionality now and in the future,” said Impinj CEO
Chris Diorio. “We will make smarter tag chips that address key use cases
like item authentication, loss prevention, and frictionless
point-of-sale. And each new IC we introduce will continue to extend the
benefits and capabilities of the Impinj platform.”
New Endpoint IC Series Delivers 2× More Chips Per Silicon Wafer
The new Impinj M700 series of endpoint ICs leverage these innovative IC
technologies to enable 300 mm silicon wafers with more than twice as
many ICs per wafer as any other RAIN RFID manufacturer’s 300 mm wafers,
and more than four times as many as any using 200 mm wafers. Impinj M700
series ICs are so small that roughly 30 million of them will fit in a
single coffee cup.
The Impinj M700 series of endpoint ICs enhances the Impinj platform,
comprising RAIN RFID endpoints, connectivity, and software.
Organizations around the world use the Impinj platform to connect items
to applications, enabling the Internet of Things. Impinj endpoint ICs
have already enabled connectivity for more than 30 billion everyday
items—including retail apparel, airline luggage, manufacturing
equipment, and logistics items—allowing businesses to make smarter
decisions, improve customer experience, and drive sales.
“The IoT platform we created and the ubiquitous item connectivity we
envision form the bedrock of an epic opportunity—to expand the
Internet's reach to trillions of everyday items and deliver data and
services for those connected items, profoundly enhancing business
efficiencies and improving peoples' lives,” said Diorio.
Impinj will demonstrate the first chips in the Impinj M700 series to
select partners and customers at RFID Journal Live from April 2-4, 2019.
About Impinj:
Impinj (NASDAQ: PI) wirelessly connects billions of everyday items such
as apparel, medical supplies, and automobile parts to consumer and
business applications such as inventory management, patient safety, and
asset tracking. The Impinj platform uses RAIN RFID to deliver timely
information about these items to the digital world, thereby enabling the
Internet of Things. www.impinj.com
View source version on businesswire.com:
https://www.businesswire.com/news/home/20190327005119/en/
Jill West
Sr. Director, Marketing Communications
Impinj, Inc.
+1-206-834-1110
Source: Impinj, Inc.